On August 15, 2024, the 3rd New Energy Thermal Management Supply Chain Conference was held in Hefei. Veseconn attended the Liquid Cooling Supercharging Heat Dissipation Module Development and New Material Application Forum and delivered a keynote speech.

We showcased UQD, VAF, CS and CN series fluid connectors at the conference, demonstrating our technical expertise and product innovation in modular connection systems. Our comprehensive connection solutions attracted many customers and received widespread praise for their unique design and performance.

We also delivered a presentation titled "Common Problems and Solutions of Liquid Cooled Fluid Connectors", providing in-depth analysis of current pain points and proposing feasible solutions.

Going forward, Veseconn will continue to pursue our vision as a specialized domestic fluid connector provider, driven by technological innovation, to deliver professional and reliable interconnection solutions for data center customers.